TPAD is a Printed Circuit Board (PCB) technology that makes it possible to remove the thermal barriers inherent in many POWER LED PCB's as the dielectric layer which isolates the trace from a metallised base material like aluminium or copper is inefficient due to its material composition. The removal of the dielectric under the thermal pad of a LED provides a clear path to ambient faster and more efficiently than any conventional FR4 or MCPCB. TPADprovides superior thermal performance for medium to high power LEDs at both rated drive current and for overclocking. This is the most economical & scalable "Direct Thermal Path" MCPCB solution available for power LED applications.
TPAD technology has higher thermal efficiency than even the very best MCPCB in the market. TPADMCPCB's are available with Aluminum base metal or Copper base metal. Aluminum based TPAD can transfer heat at the rate of 240.0 W/m.K and Copper based TPAD can transfer heat at a rate of 385.0 W/m.k. Conventional MCPCBs have a heat transfer rate of 1-2 W/m.k.
We are currently moving many of our most popular MCPCB to TPAD but every PCB we list on site can be given the TPAD treatment. We also would also be very keen to quote your custom PCB requirement in TPAD, please upload your gerbers via our Contact Page
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