AIM’s NC254 Solder Paste combined with Sn63/Pb37 offers very good wetting, extremely low and clear residues and cleans very well with standard clearning chemicals.
- 63% Tin, 37% Lead
- 12-14 hour tack line
- Clear Pin-probe Testable Residue
- Excellent Printing
- Wide Process Window
- Meets Bellcore and IPC requirements
Two unique profile families are depicted below; both can be used in ramp-spike or ramp-soak-spike applications, and they each have similar reflow temperatures.
The two profiles differ in where they reach their respective peak temperatures, as well as the time above liquidus (TAL). The shorter profile of the two would apply to smaller assemblies, where as the longer profile would apply to larger assemblies, such as backplanes or high-density boards.
Oven efficiency, board size/mass, component type and density all influence the final profile for a given assembly. These profiles are starting points, and processing boards with thermal-couples attached is recommended to optimise the process