Premium Thermal Interface Material for Enhanced Performance

Elevate Your Device’s Efficiency with Optimal Thermal Management

Introducing our high-performance, cost-effective thermal interface material, designed meticulously for applications requiring both electrical isolation and superior thermal transfer. This cutting-edge material boasts a grain-oriented, plate-like structure, ensuring exceptional thermal conductivity. With a remarkable rate of 240 W/mK in the XY plane and 5 W/mK through the Z-axis, it sets a new standard for thermal management solutions.

Tailored Dimensions for Precision Fit

Our thermal pads are precisely cut into 27mm squares, perfectly suited for Cree CXB and CXA3070, as well as 28mm Chip-on-Board (COB) LEDs, ensuring a seamless fit for a wide range of high-performance applications.

Features at a Glance

• Exceptional Thermal Conductivity: Experience unparalleled heat dissipation with 5 W/mK in the Z-axis and 240 W/mK in the XY axis, powered by >98% graphite content.
• Optimal Thickness Variability: Available in thicknesses of 0.005”, 0.010”, and 0.020” (0.125mm, 0.25mm, and 0.50mm), providing flexibility for different assembly requirements.
• Convenient Self-Adhesive Design: Simplifies assembly with a self-adhesive side, ensuring secure attachment to the COB’s back for efficient thermal management.

Ideal Applications

• Power Conversion Equipment
• Power Supplies
• High Power LED Thermal Interface Materials (TIM)

User-Friendly Guidelines for Optimal Performance

1. Carefully remove the thermal pad from the release film, ensuring gentle handling.
2. Clean and dry the substrate surface before application.
3. Align and apply the thermal pad directly to the COB.
4. Firmly press to establish a solid thermal contact.
5. The thermal pad is designed for both application and removal, providing durability and flexibility during installation.

Product Specifications

• Thermal Conductivity: A robust 5.0 W/m.K.
• Dimensional Precision: Standard size of 30mm x 30mm x 0.5mm, with custom dimensions available upon request.
• Versatility in Thickness: Offering a thickness range from 0.5 to 2.0mm to accommodate various requirements.

Our thermal interface material not only meets but exceeds expectations in thermal management, offering an effective solution for enhancing the performance and longevity of your high-power devices.