FR4-HB20ROUND-IAD

FR4-HB20ROUND-IAD. This printed circuit board with FR4 base has been developed for Cree High Brightness(HB) size leds  It allows you to quickly create your prototypes of LED modules based on Cree® PLCC6 or others. With it’s high thermal conductivity of 1 W/mK  which is ideal for LED lighting.

The FR4-HB20ROUND-IAD is designed to take 1 Cree HB style Led’s.

The board allows for individual die access for each Led die

Thermal Path :  Dielectric under the thermal pad of LED

The FR4-HB20ROUND-IAD module requires careful attention to mounting and cooling to ensure that the junction temperature of the LED is kept well below the maximum rating as specified in the LED documentation published by Led Manufacturers

For optimal cooling, we recommend that the module be mounted to a suitable finned heat sink (aluminium or copper) that is exposed to open air. The module can be mounted to a heat sink in various ways

• 20mm pressure sensitive, thermally conductive tape (Recommended)
• Thermal Compound: Requires the use of mechanical fasteners

Before fastening the module to the heat sink, ensure that the two mating surfaces are perfectly flat and clean in order to maximise heat transfer to the the sink.

The bottom of the LED is electrically neutral, so it is not necessary to electrically isolate the base from the cooling surface.

Please note the use of Thermal Adhesives makes the PCB unlikely to be removed for servicing. Please consider this if removal of the board is desired as another TIM may be a better choice. 

Termination: The board has multiple pads in Cathode and anode to allow for wire clearance in multiple application

Specifications