MCPCB-MTG-Star-CU

The MCPCB-MTG-Star-CU uses latest pillar design technology to minimise thermal resistance by eliminating the dielectric layer so that the LED thermal pad is soldered directly to the aluminium or copper base. This ensures the lowest possible LED junction temperature, resulting in increased LED life, light power output and overall reliability.

The MCPCB-MTG-Star-CU is designed to take 1 leds, with 3.45×3.45mm base, so will suit Cree MTG leds with the same base dimensions.

Direct Thermal Path : No Dielectric under the thermal pad of LED

The MCPCB-MTG-Star-CU module requires careful attention to mounting and cooling to ensure that the junction temperature of the LED is kept well below the maximum rating as specified in the LED documentation published by Led Manufacturers

For optimal cooling, we recommend that the module be mounted to a suitable finned heat sink (aluminium or copper) that is exposed to open air. The module can be mounted to a heat sink in various ways

• Arctic Alumina thermally conductive adhesive
• Thermal Compound: Requires the use of mechanical fasteners

Before fastening the module to the heat sink, ensure that the two mating surfaces are perfectly flat and clean in order to maximise heat transfer to the the sink.

The bottom of the LED MCPCB is electrically neutral, so it is not necessary to electrically isolate the base from the cooling surface.

Please note the use of Thermal Adhesives makes the PCB unlikely to be removed for servicing. Please consider this if removal of the board is desired as another TIM may be a better choice. 

Heatsink: Small Form heatsinks to suit

Termination: The board has multiple pads in Cathode and anode to allow for wire clearance in multiple application

* some holders may require modifications to allow wire access to the PCB, Cutter assumes no responsibility for holder modifications

Specifications