MCPCB-SOC08-1MCE: This Aluminium PCB is very specifically Cree MCE. It is designed to take 1 led
*Please check manufacturers data sheets to ensure compatibility with this PCB foot print
Non Direct Thermal Path : Dielectric under the thermal pad of LED
MCPCB-SOC08-1MCE board requires careful attention to mounting and cooling to ensure that the junction temperature of the LED is kept well below the maximum rating as specified in the LED documentation published by Led Manufacturers
For optimal cooling, we recommend that the module be mounted to a suitable heat sink (aluminium Flat plate is perfect but total thickness will depend on the total power used) that is exposed to open air. The module can be mounted to a heat sink in various ways
- Pressure sensitive, thermally conductive tape (Recommended)
- Arctic Alumina thermally conductive adhesive
Before fastening the module to the heat sink, ensure that the two mating surfaces are perfectly flat and clean in order to maximise heat transfer to the the sink.
The bottom of the LED MCPCB is electrically neutral, so it is not necessary to electrically isolate the base from the cooling surface.
Please note the use of Thermal Adhesives makes the PCB unlikely to be removed for servicing. Please consider this if removal of the board is desired as another TIM may be a better choice.
|Aluminium with Dielectric
|33mm Round PCB
|33mm x 2mm
|BASE METAL TYPE
|DIRECT THERMAL PATH
|GLASS TRANSITION TEMP.
|170 degree Celsius