MCPCB-XMLROU-13

MCPCB-XMLROU-13. This printed circuit board with Copper base has been developed for Cree XML, XML2 and XHP50 and allows you to quickly create your prototypes of LED modules based on Cree XML, XML2 and XHP50. With it’s high thermal conductivity of 390 W/mK with its direct thermal path, this printed circuit board is able to drain the heat of the LED components through the Copper base, which is ideal for LED lighting. This Metal Core PCB is manufactured with UL certified Copper substrates.

The MCPCB-XMLROU-13 is designed to take one Cree XML or XHP50. The board layout is for a single Led

Thermal Path :  No dielectric under the thermal pad of LED

The MCPCB-XMLROU-13 module requires careful attention to mounting and cooling to ensure that the junction temperature of the LED is kept well below the maximum rating as specified in the LED documentation published by Led Manufacturers

For optimal cooling, we recommend that the module be mounted to a suitable finned heat sink (aluminium or copper) that is exposed to open air. The module can be mounted to a heat sink in various ways

• 13mm pressure sensitive, thermally conductive tape (Recommended)
• Arctic Alumina thermally conductive adhesive
• Thermal Compound: Requires the use of mechanical fasteners

Before fastening the module to the heat sink, ensure that the two mating surfaces are perfectly flat and clean in order to maximise heat transfer to the the sink.

The bottom of the LED MCPCB is electrically neutral, so it is not necessary to electrically isolate the base from the cooling surface.

Please note the use of Thermal Adhesives makes the PCB unlikely to be removed for servicing. Please consider this if removal of the board is desired as another TIM may be a better choice. 

Optics Support: The board is drilled to take various Optics*

Termination: The board has multiple pads in Cathode and anode to allow for wire clearance in multiple application

* some holders may require modifications to allow wire access to the PCB, Cutter assumes no responsibility for holder modifications

Specifications