MCPCB-XP407-IADCU-TPAD

Direct Thermal Path : No Dielectric under the thermal pad of LED

The MCPCB-XP407-IADCU-TPAD requires careful attention to mounting and cooling to ensure that the junction temperature of the LED is maintained below the maximum rating as specified in the LED documentation published by Led Manufacturers

For optimal cooling, we recommend that the PCB be mounted to a suitable finned heat sink (aluminium or copper) that is exposed to open air. The PCB can be mounted to a heat sink in various ways

• 40mm pressure sensitive, thermally conductive tape (Recommended)
• Arctic Alumina thermally conductive adhesive
• Thermal Compound: Requires the use of mechanical fasteners

Before fastening the PCB to a heat sink, ensure that the two mating surfaces are perfectly flat and clean in order to maximise heat transfer to the sink.

The bottom of the LED MCPCB is electrically neutral, so it is not necessary to electrically isolate the base from the cooling surface.

**Please note the use of Thermal Adhesives makes the PCB unlikely to be removed for servicing. Please consider this if removal of the board is desired as another TIM may be a better choice.** 

Specifications