XLamp XP-E2. Latest Release from Cree Far Red in XPE-2
XPEBFR-L1-0000-00901: Delivering high performance and lower system cost to XLamp XP LED designs
Now available in best-in-class efficiency Photo Red (660 nm) & Far Red (730 nm)
For many years, XLamp XP-E2 LEDs have been the preferred LED choice for lighting manufacturers looking to combine different colors of light together to service specialty lighting applications. The XP-E2 platform offers an unbeatable combination of optical control, excellent light output and the ceramic high-power LED reliability that has made Cree famous. The XP-E2 LED family is now available in Photo Red (660 nm) and Far Red (730 nm) colors to deliver the family’s benefits to the LED horticulture lighting industry, with 68 percent higher performance than the competition.
Built on Cree’s revolutionary SC³ Technology™ Platform, XP-E2 LEDs deliver higher lumens per watt and lumens per dollar to lower system costs for existing XP-E designs. XP-E2 LEDs leverage the same XP footprint and are optically compatible with the original XP-E LED – providing drop-in-ready performance enhancements to shorten design cycle and improve customer time-to-market.
Characterized and binned at 85°C, the XLamp® XP-E2 White LED delivers up to 20% more lumens-per-watt and double the lumens-per-dollar compared to the original XP-E LED. The XP-E2 White LED can enable a broad range of high-lumen applications, from indoor and outdoor to portable and lamp retrofits. The XLamp® XP-E2 Color LEDs deliver up to 88% higher maximum light output compared to alternative high-power color LEDs, enabling lighting manufacturers to more cost-effectively address a wide spectrum of applications such as architectural, vehicle and display lighting.
Size | 3.45 x 3.45 mm |
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Product Options | White Color |
Maximum Drive Current | 1 A |
Max Power (W) | 3 W |
Max Light Output (lm) | 283 lm |
Maximum Efficacy at Binning Conditions (lm/W) | 137 lm/W |
Typical Forward Voltage | 2.9 V White @ 350 mA |
Maximum Reverse Voltage | 5 V |
Viewing Angle | 110 |
Maximum Junction Temperature | 150 °C |
Binning | 85°C ANSI |
Maximum ESD Withstand Voltage | 8000 V (HBM per Mil-Std-883D) |
ESD Classification | Class 2(HBM per Mil-Std-883D) |
Reflow Solderable | Yes – JEDEC J-STD-020C-compatible |
RoHS-Compliant | Yes |
REACh-Compliant | Yes |
UL-Recognized | Yes – Level 4 Enclosure Consideration |
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