CU-XHP50Ring-50-657

Description

CU-XHP50Ring-50-657. This Led Engine is based on an Aluminium base and has been developed for Cree XML and XHP50 and other 5.0mm Sq Leds with two termination pads and allows you to quickly create your prototypes of LED modules based on Cree XML/XHP50 LEDs. With it’s high thermal conductivity of 2 W/mK. This Metal Core PCB is manufactured with UL certified Aluminium substrates.

The MCPCB is designed to take four Cree XML or XHP50 Leds. The board layout is series wired. The Led board is perfect for using around a small camera lens, circular backlight or bollard applications. It has an ID of 34mm

The board comes prefitted with 4 XHP50B(Gen2) leds in a 6500k bin for cool white application. We use the highest flux bins possible so will be a minimum U4 bin.

Thermal Path   

Dielectric under the thermal pad of LED. We can produce a Copper Direct thermal path version as a custom product

The CU-XHP50Ring-50-657 module requires careful attention to mounting and cooling to ensure that the junction temperature of the LED is kept well below the maximum rating as specified in the LED documentation published by Led Manufacturers

For optimal cooling, we recommend that the module be mounted to a suitable finned heat sink (aluminium or copper) that is exposed to open air. The module can be mounted to a heat sink in various ways

• Pressure sensitive Thermal Tape, thermally conductive tape (Recommended)
• Thermal Compound: Requires the use of mechanical fasteners

Before fastening the module to the heat sink, ensure that the two mating surfaces are perfectly flat and clean in order to maximise heat transfer to the the sink.

The bottom of the LED MCPCB is electrically neutral, so it is not necessary to electrically isolate the base from the cooling surface.

Please note the use of Thermal Adhesives makes the PCB unlikely to be removed for servicing. Please consider this if removal of the board is desired as another TIM may be a better choice. 

Optics Support

There are no specific optics suited to this PCB, but the performance of light may be improved by placing behind a diffuser material to avoid LED Hot spots and using a Conical Side emitting reflector for Bollard Applications

Termination

The board has multiple pads in Cathode and anode to allow for wire clearance in multiple application

* some holders may require modifications to allow wire access to the PCB, Cutter assumes no responsibility for holder modifications

Specifications