MCPCB-XEG-L50-CU

Product Description

MCPCB-XEG-L50-CU Overview

This printed circuit board, designated as MCPCB-XEG-L50-CU, is crafted from a pure Copper metal core, specifically engineered for Cree XEG LEDs. It serves as an expedient solution for the rapid prototyping of LED modules utilizing Cree XEG LEDs. The Metal Core PCB is fabricated using UL certified copper substrates, ensuring compliance with industry standards.

Thermal Conductivity and Design

The PCB boasts a thermal conductivity rating of 395w/m.k, indicative of its efficient heat dissipation capabilities. It incorporates a Direct Thermal Path design, which optimizes thermal management by facilitating direct heat transfer from the LED junction to the underlying metal core.

Configuration and Capacity

The MCPCB-XEG-L50-CU is intricately designed to accommodate 10 Cree XEG LEDs. The board’s layout is strategically organized to position these 10 LEDs in a parallel configuration, optimizing electrical distribution and light output consistency across the module.

Thermal Management Protocol

Absence of Dielectric Material Beneath LED Thermal Pad

Proper thermal management is crucial for the module, necessitating meticulous attention to its mounting and cooling strategies. This is to guarantee that the LED’s junction temperature remains significantly below the maximum limit as delineated in the technical documentation provided by LED manufacturers.

Recommended Cooling Method

For efficient thermal dissipation, it is advised to affix the module to a suitably designed finned heat sink (constructed from either aluminium or copper) with exposure to ambient air. The module can be secured to the heat sink using various methodologies:

1. Pressure-Sensitive, Thermally Conductive Adhesive Tape: This is the preferred method.
2. Thermal Paste Application: Requires the employment of mechanical fastening devices.

Surface Preparation for Heat Transfer

Prior to the attachment of the module onto the heat sink, it is imperative to ensure that the interfacing surfaces are impeccably flat and free from contaminants to optimize thermal conductivity to the sink.

Electrical Considerations for LED MCPCB

It is pertinent to note that the underside of the LED Metal-Core Printed Circuit Board (MCPCB) is electrically non-conductive. Therefore, electrical isolation of the module base from the heat sink surface is not a requirement.

Optics Support

The board is capable of using multiple types of Optics*