MCPCB-XP-Offset11Alu

This MCPCB-XP-Offset11Alu printed circuit board with Aluminium base has been developed for the Cree XP range of leds and allows you to quickly create your prototypes of LED modules based on Cree LEDs. With it’s high thermal conductivity of 2 W/mK , this printed circuit board is able to drain the heat of the LED components through the Aluminium base, which is ideal for LED lighting.

The MCPCB-XP-Offset11Alu is designed to take a single Cree XP LED.

Thermal Path :  Has a dielectric under the thermal pad of LED

The MCPCB-XP-Offset11Alu module requires careful attention to mounting and cooling to ensure that the junction temperature of the LED is kept well below the maximum rating as specified in the LED documentation published by Led Manufacturers

For optimal cooling, we recommend that the module be mounted to a suitable finned heat sink (aluminium or copper) that is exposed to open air. The module can be mounted to a heat sink in various ways

• Arctic Alumina thermally conductive adhesive
• Thermal Compound: Requires the use of mechanical fasteners

Before fastening the module to the heat sink, ensure that the two mating surfaces are perfectly flat and clean in order to maximise heat transfer to the the sink.

The bottom of the LED MCPCB is electrically neutral, so it is not necessary to electrically isolate the base from the cooling surface.

Please note the use of Thermal Adhesives makes the PCB unlikely to be removed for servicing. Please consider this if removal of the board is desired as another TIM may be a better choice. 

Optics Support: The board can be used with various Optics*

Specifications