Direct Thermal Path : Dielectric under the thermal pad of LED
The MCPCB-XP203-ASL requires careful attention to mounting and cooling to ensure that the junction temperature of the LED is maintained below the maximum rating as specified in the LED documentation published by Led Manufacturers
For optimal cooling, we recommend that the PCB be mounted to a suitable finned heat sink (aluminium or copper) that is exposed to open air. The PCB can be mounted to a heat sink in various ways
- 20mm x 38mm pressure sensitive, thermally conductive tape (Recommended)
- Arctic Alumina thermally conductive adhesive
- Thermal Compound: Requires the use of mechanical fasteners
Before fastening the PCB to a heat sink, ensure that the two mating surfaces are perfectly flat and clean in order to maximise heat transfer to the the sink.
The bottom of the LED MCPCB is electrically neutral, so it is not necessary to electrically isolate the base from the cooling surface.
**Please note the use of Thermal Adhesives makes the PCB unlikely to be removed for servicing. Please consider this if removal of the board is desired as another TIM may be a better choice.**
TPAD uses latest pillar design technology to minimise thermal resistance by eliminating the dielectric layer so that the LED thermal pad is soldered directly to the aluminium or copper base. This ensures the lowest possible LED junction temperature, resulting in increased LED life, light power output and overall reliability.
Features: 20mm x 38mm Non Direct Thermal Path Aluminium MCPCB for Cree(3) XPE/XPG/XTE/XHP35
|PCB TYPE||20 mm Linear PCB|
|PCB SIZE||20mm x 38mm x 1.65mm|
|BASE METAL TYPE||Aluminium|
|DIRECT THERMAL PATH||No|
|THERMAL CONDUCTIVITY||3 W/m.K|
|GLASS TRANSITION TEMP.||170 degree Celsius|
|COMPATIBLE LED||Cree XPE, XPG, XTE, XHP35|
ThIS board can accept Ledil, Carclo Optics, etc and other optics with the same pin footprint: Optic Carclo 105xx series and Ledil Satu Series
Select from below for other possible Optics Match