20mm-T-Tape-Star-Graph: High-Performance, cost effective thermal interface material.
Ideal for where isolated or electrical contact and thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 600-800 W/mK in the XY plane and 15 W/mK through the z-axis. 20mm-T-Tape-Star-Graph is supplied in 20mm Star for our range of 20mm star MCPCB’s
FEATURES
- High thermal conductivity of 15 W/mK in Z axis and 600-800 W/mK in the X-Y axis
- >98% graphite
- Low thermal resistance
- Thicknesses of 0.25mm.
- Not Adhesive, use fasteners to screw down under the PCB, Adhesive inhibits thermal transfer
APPLICATIONS
- Power conversion equipment
- Power supplies
- High Power Led TIM
Guidelines for Use
1. Pick up Graphite thermal pad from base
2. Make sure the surface of the substrate is clean and dried before apply the Graphite thermal pad.
3. Position the Graphite thermal pad to heatsink base.
4. Apply some pressure to ensure good contact.
5. The Graphite thermal pad can be applied and removed (care must be taken during installation to avoid tearing).
Thermal Conductivity: 15.0 W/m.K
Size 19mm diameter x 0.25mm
Product dimension and packaging: Can provide customised dimension if required x Thickness range: 0.5 to 2.0mm
Why Graphite
When designing electronic devices that require efficient heat dissipation, the choice of Thermal Interface Materials (TIMs) and Printed Circuit Board (PCB) design can significantly impact the thermal performance of the device. In particular, two common TIM options are graphite TIM pads and traditional TIM pads.
Graphite TIM pads are thin layers of graphite material with high thermal conductivity and excellent conformability to the surface of electronic components. In contrast, traditional TIM pads are made of materials such as silicone, polyurethane, or acrylic compounds and can be pre-cut to size. When choosing between these two options, the thermal conductivity and conformability of the material are key factors to consider.
Another factor to consider is the PCB design, particularly when using a Direct Thermal Path MCPCB. This design has no dielectric layer between the LED thermal pad and the electrical layer of the MCPCB, so the TIM must provide efficient heat transfer without interfering with the electrical conductivity of the circuit board.
Several studies have investigated the thermal performance of different TIMs in Direct Thermal Path MCPCBs. One study published in the Journal of Electronic Materials in 2015 found that graphite TIM pads provided better thermal performance compared to silicone-based TIM pads, resulting in lower LED junction temperatures and longer LED lifetimes.
Another study published in the journal Materials Science Forum in 2021 investigated the thermal performance of Direct Thermal Path MCPCBs with different types of TIMs, including graphite TIM pads and traditional TIM pads. The researchers found that graphite TIM pads provided better thermal conductivity and conformability, resulting in lower thermal resistance and better heat transfer compared to traditional TIM pads.
Overall, the choice of TIM and PCB design are important factors to consider when designing electronic devices that require efficient heat dissipation. Graphite TIM pads can provide better thermal performance in Direct Thermal Path MCPCBs, but traditional TIM pads may be more cost-effective depending on the specific application. Ultimately, the choice between these options will depend on the desired thermal performance and cost constraints.
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