$1.87 EX GST
Crafted for Performance: The MCPCB-XEG-20-CU
Elevate your LED prototyping game with the stellar MCPCB‑XEG‑20‑CU—a premium 20 mm Copper Star PCB engineered for the powerful Cree XEG LED. Boasting ultra-high thermal conductivity (390 W/mK) and a direct thermal path, this board efficiently dissipates heat to unlock peak brightness and reliability. Ready for rapid integration—just mate it to a finned aluminium or copper heatsink using thermal tape or compound—and enjoy sleek, worry-free performance. With UL-certified copper substrates and ENIG finish, it’s a top-tier choice for efficient, high-current LED designs.
Design Highlights
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Optimised for Cree XEG LEDs – Designed specifically to accommodate one Cree XEG LED with precision fit and simplified layout.
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Superior Thermal Management – Direct Thermal Path ensures highly effective heat dissipation via copper core, making it ideal for high-current LED applications.
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Built Tough – Made with UL-certified copper, featuring a rugged ENIG surface finish and durable 1.65 mm thickness.
501 in stock
| Price Break Qty | Discounted Price |
|---|---|
| 1 - 9 | $1.87 |
| 10 - 49 | $1.81 |
| 51 - 100 | $1.68 |
| 101 - 500 | $1.42 |
| 501 - 1000 | $1.31 |
Description
MCPCB-XEG-20-CU. This printed circuit board with Copper base has been developed for Cree XEG and allows you to quickly create your prototypes of LED modules based on Cree XEg Leds. With it’s high thermal conductivity of 390 W/mK with its direct thermal path, this printed circuit board is able to drain the heat of the LED components through the Copper base, which is ideal for LED lighting. This Metal Core PCB is manufactured with UL certified Copper substrates.
The MCPCB-XEG-20-CU is designed to take one Cree XEG Led. The board layout is for a single Led.
Design Files CAD
Thermal Design
Thermal Path : No dielectric under the thermal pad of LED
The module requires careful attention to mounting and cooling to ensure that the junction temperature of the LED is kept well below the maximum rating as specified in the LED documentation published by Led Manufacturers
For optimal cooling, we recommend that the module be mounted to a suitable finned heat sink (aluminium or copper) that is exposed to open air. The module can be mounted to a heat sink in various ways
- 20mm pressure sensitive, thermally conductive tape (Recommended)
- Thermal Compound: Requires the use of mechanical fasteners
Before fastening the module to the heat sink, ensure that the two mating surfaces are perfectly flat and clean in order to maximise heat transfer to the the sink.
The bottom of the LED MCPCB is electrically neutral, so it is not necessary to electrically isolate the base from the cooling surface.
Optics Support:
The board is drilled to take various Optics*
Termination:
The board has multiple pads in Cathode and anode to allow for wire clearance in multiple application
* some holders may require modifications to allow wire access to the PCB, Cutter assumes no responsibility for holder modifications
Specifications
| Part # | MCPCB-XEG-20-CU |
|---|---|
| PCB Technology | Copper DTP |
| PCB type | 20 mm Star PCB |
| PCB Size | 20mm x 1.65mm |
| Base Metal type | Copper |
| Finish thickness | 0.065”(1.65mm) |
| Direct Thermal Path | Yes |
| Thermal Conductivity | 390 W/m.K |
| Surface Finish | ENIG |
| Glass Transition Temp. | 170 degree Celsius |
| Compatible LED | Cree XEG |
Drawing
| Weight | 0.03 kg |
|---|---|
| Dimensions | 20 × 20 × 1.7 mm |
| MCPCB Material | Copper Direct Thermal Path |
| Led Type | Cree XEG |
| PCB Size | |
| PCB by Led Type | |
| Thermal Conductivity | |
| Total Led Quantity per PCB | |
| PCB Material | |
| PCB On Board Configuration | |
| PCB Solder Mask Colour |
Brand
Cutter
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